Surface Mount Technology
Assembly Capabilities and Services
At Obertron Electronic Manufacturing, we provide turnkey PCB assembly services focused on precision, speed, and flexibility. Our Michigan-based facility is equipped with advanced machinery and a skilled team capable of handling both surface mount (SMT) and through-hole (THT) assembly — delivering consistent results across a wide range of applications and build types.
Whether you’re launching a new prototype or scaling up for full production, our decades of industry experience help ensure every build is completed efficiently, reliably, and to the highest standards.
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Surface Mount Capabilities
Our Surface Mount Technology (SMT) line is engineered to deliver accuracy, repeatability, and efficiency for a wide range of PCB assembly needs. Whether you’re developing prototypes or moving to full-scale production, our processes and equipment ensure that every component is placed and soldered to industry standards.
Advanced Stencil Printing
Our Speedprint SP710 AVI stencil printer provides precise solder paste application, crucial for achieving reliable solder joints and minimizing defects. Custom fixtures can be produced for non-rectilinear assemblies, ensuring uniform paste deposition even on challenging layouts.
- PCBs up to 22”x22”in size
- Fine pitch stenciling capabilities
- Ability to use customer supplied stencils
- Custom fixture production for non-rectilinear assemblies
- Tailored expertise to navigate challenges and maximize opportunities.
Precision Placement
Using the Europlacer iineo pick-and-place system, we can handle fine pitch components including 01005 passives, QFN packages, and BGAs with accuracy. This flexibility allows us to support high-density board layouts and complex designs without compromising on quality or throughput.
- Support for double-sided and mixed-assemblies
- Component placement from 01005 to 50mmx50mm
- QFN and BGA placement. However, no x-ray verification capabilities
Optimized Reflow
Solder reflow is optimized using our Heller h1809 MK7 reflow oven. which allows us to create custom thermal profiles for each job. This level of control is essential to meet the specific thermal requirements of different components and board assemblies, reducing the risk of thermal damage and ensuring strong, clean solder joints.
- Custom-tuned heating profiles to ensure optimal solder paste performance for your assemblies
Scalable Production
From prototype runs to high-volume manufacturing, our SMT capabilities scale to match your production goals
Services
Let's Build Your Next Assembly
Delivering turnkey PCB assembly and wire harness services since 1986
Built with Precision. Backed by Experience.
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