PCB Fab Support

Assembly Capabilities and Services

At Obertron Electronic Manufacturing, we provide turnkey PCB assembly services focused on precision, speed, and flexibility. Our Michigan-based facility is equipped with advanced machinery and a skilled team capable of handling both surface mount (SMT) and through-hole (THT) assembly — delivering consistent results across a wide range of applications and build types.

Whether you’re launching a new prototype or scaling up for full production, our decades of industry experience help ensure every build is completed efficiently, reliably, and to the highest standards.

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PCB Fabrication Support

Although we do not manufacture bare printed circuit boards in-house, we work closely with a network of trusted PCB fabrication partners to support a wide range of board designs. Whether you prefer to supply your own PCBs or would like us to manage fabrication on your behalf, we’re here to make the process smooth, efficient, and well-matched to your production needs.


We understand that many customers want to know what kinds of PCB specs we can support before locking in their designs. The fabrication partners we work with are capable of producing boards with a wide range of materials, tolerances, and technical features — making it easier to align your design with our assembly processes.

Supported Capabilities

While specific fabrication specs may vary slightly by supplier, we commonly work with boards that meet the following criteria:

Layer Counts

  • Up to 36 layers supported; multilayer and HDI boards with blind/buried vias, microvias, and stacked via structures.
 

Material Options

  • FR-4 (including high-Tg variants), polyimide, Rogers, BT epoxy, Teflon/PTFE, Isola, and other advanced dielectric substrates.
 

Copper & Board Thickness

  • Copper weights from 1/3 oz up to 6 oz per layer with board thicknesses typically range from 0.004″ to 0.240″ (0.10 mm to 6.1 mm), depending on the stackup.
 

Trace & Spacing Tolerances

  • Outer layer trace/space down to 0.003″ (75 µm), and 0.002″ (50 µm) for inner layers, depending on copper weight and finish.
 

Drilling & Annular Rings

  • Minimum mechanical drill sizes as small as 0.008″ (0.20 mm), with support for laser-drilled microvias and tight annular rings where needed.
 

Surface Finishes

  • ENIG, lead-free HASL, immersion silver, immersion tin, OSP, and other finishes available based on your product requirements.
 

Solder Mask & Silkscreen

  • Tight solder mask registration (±0.002″–0.003″) with minimum solder dam widths supported; including various color options and silkscreen capabilities.

Working With Us

If you need fabrication support, we can coordinate directly with our partner shops to manage board builds, source materials, and ensure that the final boards meet both your electrical and mechanical requirements. We’re also happy to work with customer-supplied PCBs.

Built with Precision. Backed by Experience. 

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